IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

SANTA CLARA, Calif.–In what could be a major breakthrough for handset makers, Intel Corp. on Tuesday will enter the “system-in-a-package” (SIP) arena, by rolling out a family of products that combine ...

More system-in-a-package (SIP) designs are hitting the market to take on system-on-a-chip (SOC). ChipPAC's Marcos Karnezos: “We just finished customer qualification for a package with one ASIC, one ...

The latest system-on-a-chip (SOC) and system-in-a-package (SIP) devices combine microelectromechanical systems, optoelectronic components, sensors, and traditional circuits in a single package.

System-in-a-package (SiP) technology constitutes an enormous potential market, according to most market research firms. For example, Semico Research Corp. predicts that the revenue for SiP contract ...

ASE Technology has cut into the medical care industry supply chain with its system in a package (SiP) packaging for ultra-wideband (UWB) modules, according to industry sources. Save my User ID and ...

In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...