EINDHOVEN, The Netherlands, June 06, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled RF amplifier modules, based on a packaging innovation ...
NXP has announced a family of top-side-cooled RF amplifiers, intended to shrink and lighten radios for 5G infrastructure – the company is claiming a reduction basestation thickness and weight of over ...
NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power ...
NXP Semiconductors has unveiled a new family of top-side cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure. These smaller ...
High-volume manufacturing facility is the most advanced GaN fab for RF in the United States Governor of Arizona joins NXP executives and local, state, federal and international government officials to ...
JAC Capital has agreed to buy NXP Semiconductors‘ RF power business for $1.8 billion. The transaction is expected to be completed within the second half of this year. Eindhoven, Netherlands, May 28, ...
LONDON — Dutch chip company NXP BV has opened a radio frequency product creationcenter in Billerica, Massachusetts. The facility, located near Boston, willfocus on the design of RF and Microwave ICs ...
The RF power business line disposed of by NXP as a consequence of its acquistion of Freescale has opened its doors as Ampleon. The business was acquired in May 2015 by Chinese company Jianguang Asset ...
NXP’s understanding of RF technology has enabled some of the most rugged devices in the industry – know-how that we have instilled into our RF lighting transistors. The very high efficiency of our ...
Philadelphia, PA. NXP Semiconductors N.V. said at IMS that it is driving innovation with its expanded cellular infrastructure portfolio of GaN and silicon laterally-diffused metal-oxide semiconductor ...
NXP Semiconductors has announced a family of top-side cooled radio frequency (RF) amplifier modules, based on a packaging design intended to enable thinner and lighter radios for 5G infrastructure.
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